Technical parameters/memory capacity: 16000 B
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
25LC160A-I/STG
|
Microchip | 功能相似 | TSSOP |
16K SPI总线串行EEPROM 16K SPI Bus Serial EEPROM
|
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