Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-8
External dimensions/packaging: TSSOP-8
Other/Product Lifecycle: Not Recommended
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Microchip | 功能相似 | TSSOP-8 |
8K SPI总线串行EEPROM 8K SPI Bus Serial EEPROM
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