Technical parameters/Contact electroplating: Tin Lead
Encapsulation parameters/installation method: Through Hole
External dimensions/length: 9.12 mm
Physical parameters/contact material: Brass Alloy
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Mill-Max | 完全替代 | Through Hole |
Contact PIN Solder ST Thru-Hole Bulk
|
||
2501-3-00-80-00-00-07-0
|
Mill-Max | 功能相似 |
电路板硬件 - PCB 200u SN OVER NI
|
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