Technical parameters/access time: 900 ns
Technical parameters/access time (Max): 900 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 2.5V ~ 5.5V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/length: 4.9 mm
External dimensions/width: 3.9 mm
External dimensions/height: 1.25 mm
External dimensions/packaging: SOIC-8
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
24LC32AF-I/SN
|
Microchip | 完全替代 | SOIC-8 |
MICROCHIP 24LC32AF-I/SN EEPROM, 四分之一阵列写保护, AEC-Q100, 32 Kbit, 4K x 8位, 400 kHz, I2C, SOIC, 8 引脚
|
||
24LC32AF-I/ST
|
Microchip | 完全替代 | TSSOP-8 |
32K I2C ™串行EEPROM ,具有四分之一阵列写保护 32K I2C™ Serial EEPROM with Quarter-Array Write-Protect
|
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