Technical parameters/access time: 900 ns
Technical parameters/power supply voltage (Max): 5.5 V
Technical parameters/power supply voltage (Min): 2.5 V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/width: 3.9 mm
External dimensions/packaging: SOIC-8
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
24LC02B-I/P
|
Microchip | 完全替代 | DIP-8 |
MICROCHIP 24LC02B-I/P EEPROM, 2 Kbit, 256K x 8位, 400 kHz, I2C, DIP, 8 引脚
|
||
|
|
Rochester | 完全替代 |
MICROCHIP 24LC02B-I/SN EEPROM, 2 Kbit, 256K x 8位, 400 kHz, I2C, SOIC, 8 引脚
|
|||
24LC02B-I/SN
|
Micrel | 完全替代 | SOIC-8 |
MICROCHIP 24LC02B-I/SN EEPROM, 2 Kbit, 256K x 8位, 400 kHz, I2C, SOIC, 8 引脚
|
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