Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
24FC1025-I/SM
|
Microswitch | 完全替代 | SOIC |
MICROCHIP 24FC1025-I/SM EEPROM, 1 Mbit, 128K x 8位, 1 MHz, I2C, SOIJ, 8 引脚
|
||
24FC1025-I/SM
|
Honeywell | 完全替代 | SOIC |
MICROCHIP 24FC1025-I/SM EEPROM, 1 Mbit, 128K x 8位, 1 MHz, I2C, SOIJ, 8 引脚
|
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