Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Not Recommended for New Design
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2-5435802-2
|
Tyco Electronics | 类似代替 | DIP |
DIP, Rotary DIP, SIP Switches and DIP Shunts - Standard
|
||
2-5435802-2
|
Alcoswitch | 类似代替 |
DIP, Rotary DIP, SIP Switches and DIP Shunts - Standard
|
|||
2-5435802-2
|
TE Connectivity | 类似代替 | - |
DIP, Rotary DIP, SIP Switches and DIP Shunts - Standard
|
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