Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Not Recommended for New Design
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
3-435640-7
|
TE Connectivity | 完全替代 |
DIP开关 6位置 密封
|
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435668-5
|
TE Connectivity | 完全替代 |
DIP, Rotary DIP, SIP Switches and DIP Shunts - Standard
|
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BD06
|
C&K Components | 功能相似 | DIP |
C & K COMPONENTS BD06 DIP / SIP开关, BD系列, SPST, 通孔安装, 6 电路, DIP非密封, 24 VDC
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