Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IS61C256AH-20N
|
Integrated Silicon Solution | 功能相似 | DIP |
Standard SRAM, 32KX8, 20ns, CMOS, PDIP28, 0.3INCH, PLASTIC, DIP-28
|
||
IS61M256-20N
|
Integrated Silicon Solution | 功能相似 | DIP |
Standard SRAM, 32KX8, 20ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
|
||
KM68257CP-20
|
Samsung | 功能相似 | DIP |
32Kx8 bit high speed static RAM (5V operating), 20ns
|
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