Technical parameters/Contact electroplating: Tin Lead
Encapsulation parameters/installation method: Through Hole
External dimensions/length: 5.31 mm
Physical parameters/contact material: Brass Alloy
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2312-3-00-01-00-00-07-0
|
Mill-Max | 完全替代 |
Term Turret Single l=2.39mm
|
|||
2312-3-00-80-00-00-07-0
|
Mill-Max | 功能相似 |
电路板硬件 - PCB 200u SN OVER NI
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31-2300
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Amphenol | 功能相似 | Panel |
PCB Terminal
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31-2300
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Mill-Max | 功能相似 |
PCB Terminal
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31-2300
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C&K Components | 功能相似 |
PCB Terminal
|
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