Technical parameters/number of circuits: 1
Technical parameters/dissipated power: 700 mW
Technical parameters/dissipated power (Max): 700 mW
Technical parameters/power supply voltage: 3V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP-16
External dimensions/length: 5.00 mm
External dimensions/width: 4.40 mm
External dimensions/packaging: TSSOP-16
External dimensions/thickness: 1.00 mm
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2309NZ-1HPGG8
|
Integrated Device Technology | 完全替代 | TSSOP-16 |
IC CLOCK BUFFER 1:9 16-TSSOP; HT SUSA CODE:8542390000
|
||
IDT2309NZ-1HPG
|
Integrated Device Technology | 完全替代 | TSSOP-16 |
九个输出3.3V时钟缓冲器 NINE OUTPUT 3.3V CLOCK BUFFER
|
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