Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 10
Encapsulation parameters/Encapsulation: DFP
External dimensions/packaging: DFP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TL072MUB
|
TI | 类似代替 | DFP |
低噪声JFET输入运算放大器 LOW-NOISE JFET-INPUT OPERATIONAL AMPLIFIERS
|
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