Technical parameters/power supply voltage: 3V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/length: 4.90 mm
External dimensions/width: 3.90 mm
External dimensions/packaging: SOIC-8
External dimensions/thickness: 1.50 mm
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2305MI-1LF
|
Integrated Device Technology | 完全替代 | SOIC-8 |
3.3 VOLT零延迟低偏移缓冲器 3.3 VOLT ZERO DELAY LOW SKEW BUFFER
|
||
CY2305SXI-1
|
Cypress Semiconductor | 类似代替 | SOIC-8 |
1个基准输入,5个输出,带内部反馈
|
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