Technical parameters/Contact electroplating: Tin Lead
Encapsulation parameters/installation method: Through Hole
External dimensions/length: 3.71 mm
External dimensions/height: 2.39 mm
Physical parameters/contact material: Brass Alloy
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Mill-Max | 完全替代 | Through Hole |
电路板硬件 - PCB 200u SN/PB OVER NI
|
||
2301-1-00-50-00-00-07-0
|
Mill-Max | 功能相似 |
Circuit Board Hardware - PCB 300u ELECTRO-SOLDER
|
|||
|
|
Anaren | 功能相似 | MODULE |
PCB Terminal, ROHS COMPLIANT
|
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