Technical parameters/thermal resistance: 7.2 ℃/W
Encapsulation parameters/installation method: Solder, Horizontal
Encapsulation parameters/Encapsulation: TO-218
External dimensions/length: 25.4 mm
External dimensions/width: 35 mm
External dimensions/height: 38 mm
External dimensions/packaging: TO-218
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/REACH SVHC standards: No SVHC
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC33287
|
Multicomp | 功能相似 | TO-220 |
MULTICOMP MC33287 散热器, 方形, 电路板, 挤压, TO-220, 8.8 °C/W, 50 mm, 34.53 mm, 12.53 mm
|
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