Chip AI consultant
Encapsulation parameters/Encapsulation: FBGA
External dimensions/packaging: FBGA
Physical parameters/operating temperature: 0℃ ~ 85℃
Other/Counting: Socket
Other/Chip Density: 8 Gb
Other/Typical Operating Supply Voltage: 1.2 V
Other/Creating Levels: Commercial
Other/Main Category: DRAM Module
Other/Sub Category: DDR4 SDRAM
Other/Package Dimensions: 69.6 x 3.7 x 30 mm
Other/Operating Temperature: 0 to 85 °C
Other/Chip Package Type: FBGA
Other/Maximum Operating Supply Voltage: 1.26 V
Other/Organization: 2Gx72
Other/Minimum Operating Supply Voltage: 1.14 V
Other/Total Density: 16 Gb
Other/Data Bus Width: 72 Bit
Other/Maximum Random Access Time: 18 ns
Other/Module Type: 260SODIMM
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