Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: C
External dimensions/packaging: C
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Microsemi | 功能相似 | B |
ESD Suppressors / TVS Diodes T MET BI 500W 20.6V
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JANTX1N6116A
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Microsemi | 功能相似 | B, Axial |
Trans Voltage Suppressor Diode, 500W, 20.6V V(RWM), Bidirectional, 1 Element, Silicon,
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Microchip | 功能相似 | Bulk |
Trans Voltage Suppressor Diode, 500W, 13.7V V(RWM), Bidirectional, 1 Element, Silicon,
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