Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SMT
External dimensions/packaging: SMT
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Semtech Corporation | 功能相似 | SMT |
ESD Suppressors / TVS Diodes MIL1 500W BIPOLAR TVS, SQUARE:SQUARE
|
||
1N6139US
|
Microsemi | 功能相似 | C-MELF |
ESD Suppressors / TVS Diodes MIL1 500W BIPOLAR TVS, SQUARE:SQUARE
|
||
|
|
Microchip | 功能相似 | B,SQ-MELF |
T MET BI 500W 7.5V SM ; HT SUSA CODE:8504409570
|
||
JANTXV1N6103AUS
|
Semtech Corporation | 功能相似 | SMD |
T MET BI 500W 7.5V SM ; HT SUSA CODE:8504409570
|
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