Technical parameters/Contact electroplating: Gold
Technical parameters/rated current: 1.00 A
Technical parameters/direction: Vertical
Technical parameters/contact type: SPDT
Encapsulation parameters/installation method: Solder Lug, Panel
External dimensions/length: 12.7 mm
External dimensions/width: 6.60 mm
Physical parameters/contact material: Copper Alloy
Physical parameters/operating temperature: -30℃ ~ 85℃
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
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