Technical parameters/Contact electroplating: Tin
Technical parameters/number of circuits: 1
Encapsulation parameters/installation method: PC Board
External dimensions/height: 10.4 mm
Physical parameters/contact material: Beryllium Copper
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BK/1A1907-03-R
|
Cooper Bussmann | 功能相似 |
BUSSMANN BY EATON BK/1A1907-03-R 保险丝座
|
|||
BK/1A1907-03-R
|
Eaton Bussmann | 功能相似 | - |
BUSSMANN BY EATON BK/1A1907-03-R 保险丝座
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review