Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS90C383BMT/NOPB
|
National Semiconductor | 功能相似 | TSSOP-56 |
TEXAS INSTRUMENTS DS90C383BMT/NOPB 驱动器, LVDS, 发送器, 60 mA, -10 °C, 70 °C, 3 V
|
||
SN65LVDS93ADGG
|
TI | 功能相似 | TSSOP-56 |
TEXAS INSTRUMENTS SN65LVDS93ADGG SerDes, 串行/解串器, 135 Mbps, CMOS, LVDS, TSSOP, 56 引脚
|
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