Technical parameters/power supply voltage: 2.5 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 356
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
EPF10K100EBC356-2
|
Intel | 完全替代 | BGA |
集成电路
|
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