Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 38
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Not Recommended for New Designs
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BQ20Z75DBT
|
TI | 功能相似 | TSSOP-38 |
SBS 1.1标准的电量监测计和保护,使能IC采用Impedance Track SBS 1.1-COMPLIANT GAS GAUGE AND PROTECTION-ENABLED IC WITH IMPEDANCE TRACK
|
||
BQ20Z75DBTR
|
TI | 功能相似 | TFSOP-38 |
SBS 1.1标准的电量监测计和保护,使能IC采用Impedance Track SBS 1.1-COMPLIANT GAS GAUGE AND PROTECTION-ENABLED IC WITH IMPEDANCE TRACK
|
||
BQ20Z75DBTR-V160
|
TI | 功能相似 | TSSOP-38 |
SBS 1.1标准的电量监测计和保护,使能IC采用Impedance Track SBS 1.1-COMPLIANT GAS GAUGE AND PROTECTION-ENABLED IC WITH IMPEDANCE TRACK
|
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