Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: FBGA
External dimensions/packaging: FBGA
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
GSI | 功能相似 | BGA-165 |
静态随机存取存储器 1.8 or 1.5V 1M x 18 18M
|
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