Technical parameters/tolerances: ±2 %
Technical parameters/rated power: 2.3 W
Technical parameters/dissipated power: 2.3 W
Technical parameters/resistance: 10 KΩ
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/rated voltage: 50 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC-16
External dimensions/length: 11.18 mm
External dimensions/width: 7.62 mm
External dimensions/height: 1.4 mm
External dimensions/packaging: SOIC-16
Physical parameters/operating temperature: -55℃ ~ 125℃
Physical parameters/temperature coefficient: ±100 ppm/℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: -
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
4816P-001-103
|
Bourns J.W. Miller | 功能相似 | SOM-16 |
电阻器网络与阵列 10K 2% 16Pin SMT
|
||
767163103GP
|
CTS | 完全替代 | SOIC-16 |
767 系列 11.18 x 5.59 mm 2.3 W 10 kOhm ±2 % 50 V 表面贴装 电阻网络 -SOIC-16
|
||
768163103G
|
CTS | 完全替代 | SOIC-16 |
RES ARRAY 8 RES 10KΩ 16SOIC
|
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