Technical parameters/Contact electroplating: Gold
Technical parameters/direction: Vertical
Technical parameters/number of pins: 12
Technical parameters/rated current (Max): 0.3A @115VAC
Technical parameters/Contact resistance (Max): 50 mΩ
Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/length: 19.05 mm
External dimensions/width: 19.05 mm
External dimensions/height: 42.32 mm
External dimensions/diameter: 17.5 mm
External dimensions/packaging: DIP
Physical parameters/contact material: Silver Alloy, Beryllium Copper
Other/Product Lifecycle: Active
Other/Packaging Methods: Box
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
Customs information/HTS code: 8536509020
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