Technical parameters/working voltage: 1.35 V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: FBGA
External dimensions/packaging: FBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Micron | 类似代替 | FBGA-96 |
DRAM Chip DDR3L SDRAM 8Gbit 512Mx16 1.35V 96Pin FBGA
|
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