Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PI3B3253LE
|
Diodes | 功能相似 | TSSOP-16 |
4:1 3.3 V 5 Ohm 表面贴装 多路复用器 / 解复用器 - TSSOP-16
|
||
PI3B3253LEX
|
Pericom Semiconductor | 功能相似 | TSSOP-16 |
4:1 3.3 V 双通道 5 Ohm 表面贴装 多路复用器/解复用器 开关 - TSSOP-16
|
||
|
|
Renesas Electronics | 功能相似 | TSSOP-16 |
总线开关, 2 放大器, 总线开关, 9 ohm, TSSOP, 16 引脚
|
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