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Description MULTICOMP 2213S-10G Board to board connection, 2213S series, 10 contacts, needle holder, 2.54mm, through-hole installation, 2 rows
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Packaging
Delivery time
Packaging method
Standard packaging quantity 1
0.3  yuan 0.3yuan
20+:
$ 0.4023
50+:
$ 0.3725
100+:
$ 0.3576
300+:
$ 0.3457
500+:
$ 0.3367
1000+:
$ 0.3308
5000+:
$ 0.3248
10000+:
$ 0.3189
Quantity
20+
50+
100+
300+
500+
Price
$0.4023
$0.3725
$0.3576
$0.3457
$0.3367
Price $ 0.4023 $ 0.3725 $ 0.3576 $ 0.3457 $ 0.3367
Start batch production 20+ 50+ 100+ 300+ 500+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(2500) Minimum order quantity(20)
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Technical parameters/number of contacts: 10

Technical parameters/polarity: Male

Technical parameters/Contact electroplating: Gold

Technical parameters/rated voltage (AC): 250 V

Technical parameters/rated current: 3.00 A

Technical parameters/insulation resistance: 1.00 GΩ

Technical parameters/number of rows: 2

Technical parameters/Flammability level: UL 94 V-0

Technical parameters/Contact resistance: 20.0 mΩ

Encapsulation parameters/installation method: Through Hole

Physical parameters/contact material: Copper Alloy

Other/Product Lifecycle: Unknown

Other/Manufacturing Applications: Industrial, industry

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/REACH SVHC standards: No SVHC

Compliant with standard/REACH SVHC version: 2015/12/17

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
TSW-105-23-G-D-LL TSW-105-23-G-D-LL Samtec 类似代替 -
板至板连接, 垂直, 2.54 mm, 10 触点, 针座, TSW系列, 通孔安装, 2 排
PDF
TSW-105-23-L-D-LL TSW-105-23-L-D-LL Samtec 类似代替
板至板连接, 垂直, 2.54 mm, 10 触点, 针座, TSW系列, 通孔安装, 2 排
PDF

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