Technical parameters/Contact electroplating: Tin
Technical parameters/number of pins: 1
Encapsulation parameters/installation method: Through Hole
External dimensions/length: 23 mm
External dimensions/width: 65.53 mm
External dimensions/height: 13.29 mm
Physical parameters/contact material: Copper Alloy
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Other/Manufacturing Applications: Yes
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/ELV standards: Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Tyco Electronics | 功能相似 |
PCB 安装 XFP 机架组件
|
|||
1658871-1
|
TE Connectivity | 功能相似 |
PCB 安装 XFP 机架组件
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review