Technical parameters/number of contacts: 16
Technical parameters/Contact electroplating: Gold
Technical parameters/rated current: 3 A
Technical parameters/number of rows: 2
Technical parameters/installation angle: 180 °
Technical parameters/rated current (Max): 3A/contact
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: Open Frame
Packaging parameters/pin spacing: 2.54 mm
External dimensions/length: 20.3 mm
External dimensions/width: 10.2 mm
External dimensions/height: 2.41 mm
External dimensions/packaging: Open Frame
External dimensions/pin spacing: 2.54 mm
Physical parameters/contact material: Beryllium Copper
Physical parameters/operating temperature: -55℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: Industrial, industry
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
816-AG10D
|
Buchanan | 类似代替 |
AMP FROM TE CONNECTIVITY 816-AG10D 芯片插座, DIP, 触点数:16, 排距:0.3""
|
|||
816-AG10D
|
Tyco Electronics | 类似代替 |
AMP FROM TE CONNECTIVITY 816-AG10D 芯片插座, DIP, 触点数:16, 排距:0.3""
|
|||
816-AG11D-ESL-LF
|
Buchanan | 功能相似 |
AMP FROM TE CONNECTIVITY 816-AG11D-ESL-LF 芯片和元件插座, 800系列, DIP插座, 16 触点, 2.54 mm, 7.62 mm, 镀金触芯
|
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