Technical parameters/tolerances: ±0.5 %
Technical parameters/rated power: 0.1 W
Technical parameters/resistance: 2.49 kΩ
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation (metric): 2012
Encapsulation parameters/Encapsulation: 0805
External dimensions/length: 2 mm
External dimensions/width: 1.25 mm
Dimensions/Packaging (Metric): 2012
External dimensions/packaging: 0805
Physical parameters/operating temperature: -55℃ ~ 155℃
Physical parameters/temperature coefficient: ±50 ppm/℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/ELV standards: Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
5-2176092-1
|
TE Connectivity | 类似代替 | 0805 |
Res Thin Film 0805 2.49KΩ 0.1% 0.25W(1/4W) ±25ppm/℃ Epoxy Pad SMD T/R
|
||
RN73C2A2K49BTD
|
Holsworthy | 完全替代 | 0805 |
Res Thin Film 0805 2.49KΩ 0.1% 0.1W(1/10W) ±10ppm/℃ Molded SMD SMD Paper T/R
|
||
RN73C2A2K49BTD
|
TE Connectivity | 完全替代 | 0805 |
Res Thin Film 0805 2.49KΩ 0.1% 0.1W(1/10W) ±10ppm/℃ Molded SMD SMD Paper T/R
|
||
RP73D2A2K49BTDF
|
TE Connectivity | 类似代替 | 0805 |
Res Thin Film 0805 2.49KΩ 0.1% 0.125W(1/8W) ±15ppm/℃ Molded SMD T/R
|
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