Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
NCP1561DR2
|
ON Semiconductor | 功能相似 | SOIC-16 |
推挽式PWM控制器,用于48 V通信系统 Push-Pull PWM Controller for 48 V Telecom Systems
|
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