Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube, Rail
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Renesas Electronics | 功能相似 | CDIP-8 |
为4MHz ,高电源电压运算放大器 4MHz, High Supply Voltage Operational Amplifiers
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