Technical parameters/power supply voltage: 0.97V ~ 1.03V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 1157
Encapsulation parameters/Encapsulation: FCBGA-1156
External dimensions/packaging: FCBGA-1156
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC7VX330T-1FFG1157I
|
Xilinx | 完全替代 | FCBGA-1156 |
FPGA Virtex®-7 XT Family 326400 Cells 28nm Technology 1V 1157Pin FC-BGA
|
||
XC7VX330T-2FFG1157I
|
Xilinx | 完全替代 | FCBGA-1156 |
FPGA Virtex-7 XT Family 326400 Cells 28nm Technology 1V 1157Pin FC-BGA
|
||
XC7VX330T-3FFG1157E
|
Xilinx | 完全替代 | FCBGA-1156 |
FPGA Virtex-7 XT Family 326400 Cells 28nm Technology 1V 1156Pin FCBGA Tray
|
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