Technical parameters/number of contacts: 30
Technical parameters/polarity: Male
Technical parameters/Contact electroplating: Gold
Technical parameters/number of rows: 2
Technical parameters/number of pins: 30
Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: -
Packaging parameters/pin spacing: 2.54 mm
External dimensions/length: 38.1 mm
External dimensions/width: 5.08 mm
External dimensions/height: 2.54 mm
External dimensions/packaging: -
External dimensions/pin spacing: 2.54 mm
Physical parameters/shell color: Black
Physical parameters/contact material: Phosphor Bronze
Physical parameters/shell material: Plastic
Other/Product Lifecycle: Active
Other/Manufacturing Applications: -
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TSW-115-08-G-D
|
Samtec | 完全替代 | - |
2.54mm 方针
|
||
TSW-115-08-G-D-RA
|
Samtec | 完全替代 |
SAMTEC TSW-115-08-G-D-RA Board-To-Board Connector, 2.54mm, 30Contacts, Header, TSW Series, Through Hole, 2Rows
|
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