Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TL1453CN
|
TI | 功能相似 | PDIP-16 |
双脉宽调制控制电路 DUAL PULSE-WIDTH-MODULATION CONTROL CIRCUIT
|
||
TL1453CNSR
|
TI | 功能相似 | SOP-16 |
双脉宽调制控制电路 DUAL PULSE-WIDTH-MODULATION CONTROL CIRCUIT
|
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