Technical parameters/RAM size: 32K x 8
Technical parameters/dissipated power: 500 mW
Technical parameters/Analog to Digital Conversion (ADC): 1
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 500 mW
Technical parameters/Digital to Analog Conversion (DAC): 1
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 80
Encapsulation parameters/Encapsulation: TQFP-80
External dimensions/length: 12 mm
External dimensions/width: 12 mm
External dimensions/height: 1.05 mm
External dimensions/packaging: TQFP-80
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Not Recommended
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 5A002
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SIM3L167-C-GLR
|
Silicon Labs | 类似代替 | TFBGA-80 |
MCU 32Bit SiM3L1xx ARM Cortex M3 RISC 256KB Flash 2.5V/3.3V 80Pin TFBGA T/R
|
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