Technical parameters/Contact electroplating: Gold
Encapsulation parameters/installation method: PCB, Solder
External dimensions/length: 9.52 mm
External dimensions/width: 14.27 mm
External dimensions/height: 7.92 mm
Physical parameters/contact material: Beryllium Copper
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
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