Technical parameters/Contact electroplating: Gold
Encapsulation parameters/installation method: Panel, Solder
External dimensions/length: 17.02 mm
External dimensions/height: 5.59 mm
Physical parameters/contact material: Beryllium Copper
Physical parameters/insulation material: Teflon
Physical parameters/shell material: Brass
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
901-9889-RFX
|
Amphenol | 类似代替 | SMA |
AMPHENOL RF 901-9889-RFX 连接器, SMA直同轴插口, 隔板安装
|
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