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Model 818-AG11D-ESL
Description TE Connectivity Printed Circuit Board DIP Socket with Embossed Contact - Economy 800 Series Economy 800 Series Printed Circuit Board DIP Socket features an open trapezoidal frame style and a 2.54mm centerline. These printed circuit board DIP IC sockets can be installed vertically and embossed with four finger paired gold-plated contacts. Precision four finger internal contacts provide concentric funnel-shaped entry ports for flat and circular leads to be inserted into X and Y stackable open ladders for easy cooling, cleaning, and inspection. Thin design allows for rectangular or circular IC leads without capillary action. The bottom enclosed sleeve provides 100% anti flux and solder contamination protection and has been certified by Underwriters Laboratories component program (file number E111362). Beryllium copper internal contacts achieve the highest mechanical and electrical performance. # # # IC socket - DIL molded pins
Product QR code
Brand: TE Connectivity
Packaging
Delivery time
Packaging method Tube
Standard packaging quantity 1
9.54  yuan 9.54yuan
10+:
$ 11.4444
100+:
$ 10.8722
500+:
$ 10.4907
1000+:
$ 10.4716
2000+:
$ 10.3953
5000+:
$ 10.3000
7500+:
$ 10.2237
10000+:
$ 10.1855
Quantity
10+
100+
500+
1000+
2000+
Price
$11.4444
$10.8722
$10.4907
$10.4716
$10.3953
Price $ 11.4444 $ 10.8722 $ 10.4907 $ 10.4716 $ 10.3953
Start batch production 10+ 100+ 500+ 1000+ 2000+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(7492) Minimum order quantity(10)
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Technical parameters/number of contacts: 18

Technical parameters/Contact electroplating: Gold, Tin Lead

Technical parameters/rated current: 3 A

Technical parameters/insulation resistance: 5.00 GΩ

Technical parameters/number of rows: 2

Technical parameters/number of pins: 18

Technical parameters/Contact resistance: 10 mΩ

Technical parameters/rated current (Max): 3A/contact

Technical parameters/operating temperature (Max): 105 ℃

Technical parameters/operating temperature (Min): -55 ℃

Technical parameters/Contact resistance (Max): 10 mΩ

Encapsulation parameters/installation method: Through Hole

External dimensions/length: 22.86 mm

External dimensions/width: 10.16 mm

External dimensions/height: 4.57 mm

Physical parameters/contact material: Beryllium Copper

Physical parameters/operating temperature: -55℃ ~ 105℃

Other/Product Lifecycle: End of Life

Other/Packaging Methods: Tube

Compliant with standards/RoHS standards: Non-Compliant

Compliant with standards/lead standards: Contains Lead

Compliant with standards/ELV standards: Non-Compliant

Customs information/ECCN code: EAR99

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
818-AG11D-ES 818-AG11D-ES Buchanan 完全替代
Conn DIP Socket SKT 18POS 2.54mm Solder ST Thru-Hole Tube

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