Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.425V ~ 1.575V
Technical parameters/power supply voltage (Max): 1.575 V
Technical parameters/power supply voltage (Min): 1.425 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 484
Encapsulation parameters/Encapsulation: BGA-484
External dimensions/length: 23 mm
External dimensions/width: 23 mm
External dimensions/height: 1.73 mm
External dimensions/packaging: BGA-484
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AX250-2FGG484I
|
SOC | 完全替代 | BGA-484 |
Field Programmable Gate Array, 2816 CLBs, 250000Gates, 870MHz, 4224-Cell, CMOS, PBGA484, 1MM PITCH, ROHS COMPLIANT, FBGA-484
|
||
AX250-2FGG484I
|
Microchip | 完全替代 | FBGA |
Field Programmable Gate Array, 2816 CLBs, 250000Gates, 870MHz, 4224-Cell, CMOS, PBGA484, 1MM PITCH, ROHS COMPLIANT, FBGA-484
|
||
AX250-FG484
|
SOC | 完全替代 | BGA-484 |
FPGA - 现场可编程门阵列 Axcelerator (AX)
|
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