Technical parameters/Contact electroplating: Gold
Technical parameters/installation angle: 180 °
Encapsulation parameters/installation method: Panel
Physical parameters/contact material: Beryllium Copper
Physical parameters/insulation material: Teflon
Physical parameters/shell material: Brass
Other/Packaging Methods: Bag
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
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