Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: 3A001
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
6116LA45TPG
|
Integrated Device Technology | 功能相似 | DIP |
SRAM Chip Async Single 5V 16Kbit 2K x 8 45ns 24Pin PDIP Tube
|
||
6116SA45TPG
|
Integrated Device Technology | 功能相似 | DIP |
SRAM Chip Async Single 5V 16Kbit 2K x 8 45ns 24Pin PDIP Tube
|
||
IDT6116SA45TPGI
|
Integrated Device Technology | 功能相似 | DIP-24 |
IC SRAM 16Kbit 45NS 24DIP
|
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