Technical parameters/Contact electroplating: Gold
Encapsulation parameters/installation method: Through Hole
External dimensions/length: 3.45 mm
External dimensions/width: 3.45 mm
External dimensions/height: 4.5 mm
Physical parameters/contact material: Beryllium Copper
Physical parameters/insulation material: Teflon
Physical parameters/shell material: Brass
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
1408150-1
|
TE Connectivity | 功能相似 |
TE CONNECTIVITY 1408150-1 射频/同轴连接器, MMCX同轴, 直型插座, 通孔安装 垂直, 50 ohm, 黄铜
|
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73415-1471
|
Molex | 类似代替 | Through Hole |
MOLEX 73415-1471 射频/同轴连接器, MMCX同轴, 直型插座, 通孔安装 垂直, 50 ohm, 铍铜
|
||
908-NM22106
|
Amphenol | 类似代替 | 908 |
AMPHENOL RF 908-NM22106 射频/同轴连接器, MMCX 插座 直型, 50Ω 焊接
|
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