Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 32
Encapsulation parameters/Encapsulation: LQFP
External dimensions/packaging: LQFP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LMV1089VY/NOPB
|
National Semiconductor | 功能相似 | LQFP |
传声器前置放大器 Far-Field Noise Sup. Mic Amp
|
||
LMV1089VY/NOPB
|
TI | 功能相似 | LQFP-32 |
传声器前置放大器 Far-Field Noise Sup. Mic Amp
|
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