Technical parameters/number of contacts: 8
Technical parameters/Contact electroplating: Tin
Encapsulation parameters/installation method: Through Hole
Physical parameters/contact material: Phosphor Bronze
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/REACH SVHC standards: No SVHC
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
110-44-308-41-001000
|
Mill-Max | 类似代替 | DIP |
MILL MAX 110-44-308-41-001000 芯片插座, DIP, 8脚
|
||
4808-3000-CP
|
3M | 类似代替 |
3M 4808-3000-CP 芯片插座, DIP-8
|
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