Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC-16
External dimensions/packaging: SOIC-16
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MLX90314LDF-BAA-000-SP
|
Melexis | 功能相似 | SOIC-16 |
MLX90314 系列 6 至 35 V 表面贴装 可编程 传感器 接口 - SOIC-16W
|
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