Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: DFN
External dimensions/packaging: DFN
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LT3029EDE#PBF
|
ADI | 功能相似 | DFN |
LINEAR TECHNOLOGY LT3029EDE#PBF 芯片, 稳压器, LDO, 可调, 500mA, 双路, 16DFN
|
||
LT3029EDE#PBF
|
Linear Technology | 功能相似 | DFN-16 |
LINEAR TECHNOLOGY LT3029EDE#PBF 芯片, 稳压器, LDO, 可调, 500mA, 双路, 16DFN
|
||
LT3029IDE#PBF
|
ADI | 功能相似 | DFN |
LINEAR TECHNOLOGY LT3029IDE#PBF 芯片, 稳压器, LDO, 双路, 可调, 0.3VDO, 0.5A, 16DFN
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review