Technical parameters/dissipated power: 75 mW
Technical parameters/operating temperature (Max): 150 ℃
Technical parameters/operating temperature (Min): -65 ℃
Technical parameters/dissipated power (Max): 75 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 4
Encapsulation parameters/Encapsulation: TO-253-4
External dimensions/height: 1.1 mm
External dimensions/packaging: TO-253-4
Physical parameters/operating temperature: 150℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Agilent | 类似代替 |
Diode: Schottky rectifying; SMD; 4V; 1mA; SOT143; Package: bulk
|
|||
HSMS-8207-BLKG
|
Broadcom | 类似代替 | TO-253-4 |
Diode: Schottky rectifying; SMD; 4V; 1mA; SOT143; Package: bulk
|
||
HSMS-8207-TR1G
|
AVAGO Technologies | 完全替代 | SOT-143-4 |
Diode RF Mixer Schottky 4V 4Pin(3+Tab) SOT-143 T/R
|
||
HSMS-8207-TR1G
|
Agilent | 完全替代 |
Diode RF Mixer Schottky 4V 4Pin(3+Tab) SOT-143 T/R
|
|||
HSMS-8207-TR2G
|
Broadcom | 完全替代 | TO-253-4 |
Diode RF Mixer Schottky 4V 4Pin(3+Tab) SOT-143 T/R
|
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